Title : Temperature dependent performance analysis of mixed MWCNT bundle as VLSI interconnects

Type of Material: Thesis
Title: Temperature dependent performance analysis of mixed MWCNT bundle as VLSI interconnects
Researcher: Jindal, Pradeep Kumar
Guide: Sandha, Karmjit Singh
Department: Department of Electronics & Communication Engineering
Publisher: Thapar University, Patiala
Place: Patiala
Year: 2022
Language: English
Subject: Temperature dependent performance
MWCNT bundle
VLSI interconnects
Dissertation/Thesis Note: PhD

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035__|a(IN-AhILN)th_444767
040__|aTIET_147001|dIN-AhILN
041__|aeng
100__|aJindal, Pradeep Kumar|eResearcher
110__|aDepartment of Electronics & Communication Engineering|bThapar University, Patiala|dPatiala
245__|aTemperature dependent performance analysis of mixed MWCNT bundle as VLSI interconnects
260__|aPatiala|bThapar University, Patiala|c2022
502__|bPhD
653__|aTemperature dependent performance
653__|aMWCNT bundle
653__|aVLSI interconnects
700__|aSandha, Karmjit Singh|eGuide
905__|anotification

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