| Type of Material: | Thesis |
| Title: | Ultrathin diffusion barrier layers for copper metallization in silicon based integrated circuits |
| Researcher: | Sharma, Sumit |
| Guide: | Dinesh Kumar |
| Publisher: | Kurukshetra University |
| Place: | Kurukshetra |
| Language: | English |
| Dissertation/Thesis Note: | PhD |
| Fulltext: | Shodhganga |
| 000 | 00000ntm a2200000ua 4500 | |
| 001 | 389167 | |
| 003 | IN-AhILN | |
| 005 | 2018-08-14 09:28:17 | |
| 008 | __ | 180814t####||||ii#||||g|m||||||||||eng|| |
| 035 | __ | |a(IN-AhILN)th_389167 |
| 040 | __ | |aKRKT_132119|dIN-AhILN |
| 041 | __ | |aeng |
| 100 | __ | |aSharma, Sumit|eResearcher |
| 245 | __ | |aUltrathin diffusion barrier layers for copper metallization in silicon based integrated circuits |
| 260 | __ | |aKurukshetra|bKurukshetra University |
| 502 | __ | |bPhD |
| 700 | __ | |aDinesh Kumar|eGuide |
| 856 | __ | |uhttp://shodhganga.inflibnet.ac.in/handle/10603/151815|yShodhganga |
| 905 | __ | |anotification |
User Feedback Comes Under This section.