| Type of Material: | Thesis |
| Title: | Development of lead_free solder bumping by electroplating method for flip chip and BGA applications |
| Researcher: | Joseph, Shany |
| Guide: | Phatak, Girish J |
| Publisher: | Savitribai Phule Pune University |
| Place: | Pune |
| Language: | English |
| Dissertation/Thesis Note: | PhD |
| Fulltext: | Shodhganga |
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| 001 | 374313 | |
| 003 | IN-AhILN | |
| 005 | 2018-08-14 08:18:55 | |
| 008 | __ | 180814t####||||ii#||||g|m||||||||||eng|| |
| 035 | __ | |a(IN-AhILN)th_374313 |
| 040 | __ | |aPUNE_411007|dIN-AhILN |
| 041 | __ | |aeng |
| 100 | __ | |aJoseph, Shany|eResearcher |
| 245 | __ | |aDevelopment of lead_free solder bumping by electroplating method for flip chip and BGA applications |
| 260 | __ | |aPune|bSavitribai Phule Pune University |
| 502 | __ | |bPhD |
| 700 | __ | |aPhatak, Girish J|eGuide |
| 856 | __ | |uhttp://shodhganga.inflibnet.ac.in/handle/10603/134385|yShodhganga |
| 905 | __ | |anotification |
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