| Type of Material: | Thesis |
| Title: | Deep reactivetion etching of silicon for plasma machining process in high aspect ratio structures for MEMS and 3 dimentional Ics |
| Researcher: | Manish Kumar |
| Department: | Department of Electronics Engineering |
| Publisher: | Kurukshetra University |
| Place: | Kurukshetra |
| Year: | 2008 |
| Language: | English |
| Subject: | Electronics Engineering |
| Dissertation/Thesis Note: | PhD |
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| 001 | 218020 | |
| 003 | IN-AhILN | |
| 005 | 2011-01-13 00:00:00 | |
| 008 | __ | 081231t2008||||ii#||||g|m||||||||||eng|| |
| 035 | __ | |a(IN-AhILN)th_218020 |
| 040 | __ | |aKRKT_132119|dIN-AhILN |
| 041 | __ | |aeng |
| 100 | __ | |aManish Kumar|eResearcher |
| 110 | __ | |aDepartment of Electronics Engineering|bKurukshetra University|dKurukshetra|eIN |
| 245 | __ | |aDeep reactivetion etching of silicon for plasma machining process in high aspect ratio structures for MEMS and 3 dimentional Ics |
| 260 | __ | |aKurukshetra|bKurukshetra University|c2008 |
| 502 | __ | |bPhD |
| 653 | __ | |aElectronics Engineering |
| 905 | __ | |anotification |
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