Title : Investigations on temperature distribution stresses and redistribution in silicon wafers during processing

Type of Material: Thesis
Title: Investigations on temperature distribution stresses and redistribution in silicon wafers during processing
Researcher: Das, Jayanta kumar
Guide: Mahapatra, S
Department: Department of Electrical Engineering
Publisher: Indian Institute of Technology-bombay
Place: Mumbai
Year: 1984
Language: English
Subject: Engineering
Electronics Engineering
Microelectronics
Microelements
Electrical Engineering
Dissertation/Thesis Note: PhD

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035__|a(IN-AhILN)th_110843
040__|aIITB_400076|dIN-AhILN
041__|aeng
100__|aDas, Jayanta kumar|eResearcher
110__|aDepartment of Electrical Engineering|bIndian Institute of Technology-bombay|dMumbai|eIn
245__|aInvestigations on temperature distribution stresses and redistribution in silicon wafers during processing
260__|aMumbai|bIndian Institute of Technology-bombay|c1984
502__|bPhD
650__|aElectrical Engineering|2UGC
653__|aEngineering
653__|aElectronics Engineering
653__|aMicroelectronics
653__|aMicroelements
700__|aMahapatra, S|eGuide
905__|anotification

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