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1

Deep reactivetion etching of silicon for plasma machining process in high aspect ratio structures for MEMS and 3 dimentional Ics

Researcher:Manish Kumar
University:Kurukshetra University
Language:English
2

Deep reactive ion ethcing of silicon for plasma machining process in high aspect ration structures for MEMS and 3 dimensional Ies

Researcher:Manish Kumar
University:Kurukshetra University
Language:English